2026年5月5日 星期二

HW#9 RF PA Driver Design (Comparing optimization algorithms and pipelines)

 課堂練習 

Deadline: This Saturday at 23:59

Send all the share links to  me chang212@gmail.com by email with subject HW#9 [your id, your name]

只要做第一題

1. Benchmark the three algorithms (GD, NM, A*) and their cascades (one designed by you and the other design by AI )

  • For the five methods, each runs with 10 seeds
  • Tabulate Gain, Pout, PAE, OP1dB, S₁₁ (5 methods = 5 tables, each table with 5 metrics × 10 seeds = 40 cells).
  • Visualize all of your data

Two-stage Cascode Class-AB RF PA Driver targeting 5G n78 (3.5 GHz) in TSMC 28nm RF

Build Sub 6 GHz Power Amplifier Optimizer with Die Synced
shareartifact (Closed-Form)


2026年4月28日 星期二

HW#8 Claude Cowork

 課堂練習 

Deadline: This Saturday at 23:59

Send all the share links to  me chang212@gmail.com by email with subject HW#8 [your id, your name]


Part 1

Use Claude CoWork to benchmark  BJT Differential Pair 

 1. Experiments with 30 seeds


schematic with parameter optimizer

2. The SA code is flawed. Therefore Ad, CMRR, PM cannot be optimized. Use Cowork to diagnose and fix the code. Rerun the bencmark.

Hint: prompts for CoWork
Prompts for Claude Chat


Part 2

Benchmark the P&R for OP 741.
Experiment with 3 seeds
Measure success, congestions, wirelength, overlap pairs (before/after), Vin length match

2026年4月14日 星期二

Common issues in BJT diff pair design

BJT diff pair


Routing

(by TA)

1. unfinished routing

2. one stage diff pair 是沒有 miller 電容 cc






 (by TA)

1. SA 是無效的    

2. 檢查是否合規 

gain 47.6 db 不夠
PM 0 很危險,不穩定
GBW 太大

設計目標 (3.3V):
Ad ≥ 50 dB  |  CMRR ≥ 80 dB
GBW ≥ 100 MHz  |  PM 55°–75°
Vos ≤ 1 mV  |  Pd ≤ 20 mW
Poly R: 250 Ω/sq (±20%)
MIM C: 1 fF/μm² (±15%)


refer to sample

2026年4月13日 星期一

HW#7 Analog IC Design

課堂練習 

Deadline: This Saturday at 23:59

Send all the share links to  me chang212@gmail.com by email with subject HW#6 [your id, your name]

任選1題



1  (a) A BJT Differential Pair IC Die  (share) is incorrectly designed. Fix the die. 

(b) Make a schematic

(c) Do parameter optimization via SA (simulated annealing)

(d) Placement & Routing for the die

For example you may use Quadratic Placement  & ILP+PathFinder+A* Routing














2. Design 2-stage diff pair (share from very simple diff pair)

(a)  Make a schematic,  

(b) Draw a  silicon die, considering Miller Compensation

(c) Do P&R (Placement & Routing) for the IC